The Advanced Circuit Materials Division of Rogers Corporation, a manufacturer of materials and components for consumer electronics, has released RO4360G2 laminate, a high frequency laminate material featuring improved thermal reliability for higher maximum operating temperatures over its predecessor, RO4360 laminate.
According to the company, ideal applications for RO4360G2 laminates are “power amplifiers, LNAs, RF components (combiners/splitters), patch antennas, and as a replacement material for designs previously employing LTCC (low temperature, co-fired ceramic).”
“With a tailored high Dk of 6.15 @ 10 GHz, [the new material] allows next generation power amplifier designers to meet size and cost reduction targets. Specifically, the laminate’s higher Dk allows for a significant reduction in finished circuit board size 920 to 30 percent),” Rogers Corp. said.
“RO4360G2 laminates possess excellent thermal conductivity of 0.81 W/m/K for improved reliability, a low Z-axis CTE for reliable plated through holes, drill performance as good as or better than RO4350B laminates.”
