Silicones supplier Dow Corning has added two new products—Dow Corning TC-5622 and TC-5351 Thermally Conductive Compounds—to its line of thermal interface materials.
Offering good thermal performance and improved resistance to hardening or dry-out in end-use applications, Dow Corning’s TC-5622 thermally conductive compound is ideal for applications where heat must be dissipated across varying bond line thickness (BLT). TC-5622 contains no common solvent diluents, which translates into more consistent product performance and a lower environmental impact with respect to manufacturing, according to the company.
Designed for high performance in electronics end-markets, such as automotive, power electronics and LED lighting applications, Dow Corning’s TC-5351 thermally conductive compound is “ideal for vertical applications requiring a thermal material able to remove heat without flowing out of the gap or changing viscosity as temperatures rise.”
“These new materials exemplify Dow Corning’s proactive approach to innovating solutions to industry challenges to help our customers innovate, compete and succeed,” Margaret Servinski, new market business development manager, said.
