The Bergquist Company, a manufacturer of high-performance thermal management materials, has released Liqui-Bond SA 3505, a two-component, liquid silicone adhesive ideal for power supplies and discrete applications.
With a high thermal conductivity of 3.5 W/m-K, Liqui-Bond SA 3505 offers a thermal conductivity previously unavailable in a structural adhesive, the company said. In addition, “Liqui-Bond SA 3505 is thixotropic and although it will remain in place after dispensing, the material will flow easily under minimal pressure, resulting in little-to-no stress on fragile components during assembly.”
Refrigeration is not required because of the adhesive’s two-part liquid nature, but heat curing is recommended to achieve ideal bond strength. As cured, the strong-bonding elastomer will provide excellent thermal transfer while eliminating the need for mechanical fasteners.
