Thermal management materials manufacturer Universal Science has introduced a new thermal adhesive tape designed to be applied to FR4 or insulated metal substrate printed circuit boards (PCBs) prior to processing as a replacement for mechanical fixings.
Featuring a thermal conductivity of 2.0 W/mK and a breakdown voltage (electrical isolation) of 4 kV AC, Bondline 2000-REFLOW is ideal for use in attaching LED light engines to heat sinks in solid state lighting products, coupling power supplies or power converter modules to heat-dissipating surfaces and a range of other applications. In addition, the new material’s ability to achieve a strong structural bond between the PCB and application heatsink, chassis or heat spreader removes the need for mechanical fixings and reduces production costs and assembly time, the company said.
Bondline 2000-REFLOW is available in sheets, rolls or kiss-cut custom parts and can be applied to unprocessed PCB prior to the routing and reflow stages.
