Focused on Thermal Management, TIMs, Fans, Heat Sinks, CFD Software, LEDs/Lighting
Don’t miss out on the September 2013 issue of Electronics Cooling, which includes feature articles on Heat Pipe Integration Strategies for LED Applications; Testing of power LEDs: The latest thermal testing standards from JEDEC, as well as a calculation corner and technical briefs.
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Electronics Cooling magazine has been providing a technical data column since 1997 with the intent of providing you, the readers, with pertinent material properties for use in thermal analyses. We have largely covered the most common materials and their associated thermal properties used in electronics packaging.
