Rogers Corporation, a manufacturer of specialty materials and components that enable high performance and reliability of consumer electronics, power electronics and telecommunications infrastructure, will be featuring its new high-Dk RO4360G2 laminate and 2929 bondply materials at the PCB West 2013 conference and exhibition Sept. 25, 2013 in Santa Clara, Calif.
According to the company, the 2929 bondply material is well suited for the design and fabrication of reliable multilayer circuits with many of the company’s high-performance core materials including Rogers RT/duroid®, RO3000®, and RO4000 laminates. The new thin adhesive film is available in various thicknesses, including 1.5, 2.0, and 3.0 mils, and sheets of 2929 materials can be stacked to create thicker layers as needed. The material incorporates a proprietary cross-linking resin system that supports sequential lamination processing. It also features controlled flow characteristics for excellent results when filling blind viaholes. This unreinforced thermoset adhesive film has a low dielectric constant of 2.94 in the z-axis at 10 GHz and low dissipation factor of less than 0.003 at 10 GHz.
Also possessing improved oxidation resistance, recently introduced RO4360G2 laminates are formulated for improved thermal reliability, which will help fabricators achieve higher UL MOTs. With a high dielectric constant of 6.15 at 10 GHz, they are well suited for power-amplifier designers who need to meet challenging PCB board size reduction targets in a cost effective manner. The higher dielectric constant also enables smaller circuit dimensions for a given wavelength and frequency, allowing a significant reduction in finished circuit-board size. The RO4360G2 laminates can be processed like FR-4 materials and are compatible with most automated assembly techniques.
Rogers Corp. will also be promoting its new RO4835 high-frequency laminate material, which provides 10 times improved oxidation resistance compared to legacy RO4000 laminate materials. The RO4835 circuit materials exhibit a dielectric constant of 3.48 and a low loss tangent of 0.0037 at 10 GHz, plus low z-axis coefficient of thermal expansion (CTE) for reliable plated-through-holes. The new RO4835 circuit material is RoHS compliant and can be processed using standard fabrication methods.
