Engineered Material Systems, a supplier of electronic materials for circuit assembly applications, has released its CA-195 high thermal conductivity LED die attach adhesive for bonding LED and other small semiconductor die to silver and copper lead frames.
According to the company, CA-195 is approximately half the cost of a pure silver-filled die attach adhesive and features a high glass transition temperature (Tg) to facilitate wire bonding small die, low extractable ionics and high adhesion to silver and copper lead frames. A dispense open time greater than 24 hours (measured as a 25 percent increase in viscosity) while maintaining optimized rheology for pin transfer or needle dispensing makes the adhesive suitable for small die thermal management applications.
