Thermal interface material provider Fujipoly has released Sarcon GR45A-00, a very low modulus thermal interface material with a low thermal resistance.
Featuring a thermal conductivity of 6.0 W/m°K per ASTM D2326 (4.5 W/m°K per ISO/CD 22007-2 Hot disk) and a thermal resistance as low as 1.33°C cm2/W, the new formulation completely fills air gaps between components, board protrusions and recessed areas while exhibiting very low pressure to increase cooling performance. Sarcon GR45A-00 is available in pre-cut sheets up to a maximum size of 200mm x 300mm, but can also be die cut for custom specifications. Material thicknesses from 0.5mm to 5.0mm can be specified in 0.5mm increments.
