Fujipoly has released new Sarcon GR25A-0H2-30GY, a 0.3mm thick, low thermal resistance interface material with a low-tac surface on both sides.
According to the company, the material’s new formulation dramatically reduces material tearing and damage during assembly and rework operations and improves cooling performance by filling unwanted air gaps between board components and processors, thereby increasing surface contact with a heat sink.
Sarcon GR25A-0H2-30GY transfers heat with a thermal conductivity of 2.8 W/m°K per ASTM D2326 and a thermal resistance of .21°Cin2/W at 14.5 PSI (1.33°Ccm2/W at 100Kpa). This flame retardant TIM is available in sheets up to 300mm x 200mm and can be die-cut or trimmed to fit custom application specifications.
