NuSil Technology, a manufacturer of silicone materials for the medical, aerospace, electronics and engineering markets, has released R-2165, a new silicone solution for the protection of electronic components and systems such as sensors, relays and connectors.
“R-2165 is the latest addition to NuSil’s diverse portfolio of silicones designed for potting and encapsulating components in need of the high level of power required by many of today’s applications, such as data centers and faster data transfer in general,” Bob Umland, marketing and sales director of electronics and engineering at NuSil Technology, said.
According to the company, the gray, pourable R-2165 exhibits a moderate thermal conductivity of 0.6 W/mK. Similar to its portfolio affiliates for this class of materials, it uses platinum addition cure chemistry, offering minimal shrinkage, a cure time that can be accelerated with heat, and no cure by-products.
