The U.S. Patent and Trademark Office has awarded patent No. 8,546,935, “Semiconductor Packages,” to Micron Technology, Inc. of Boise, Idaho.
According to background information provider by the inventors, the patent covers “semiconductor packages having grooves within a semiconductor die backside, and includes semiconductor packages utilizing carbon nanostructures (such as, for example, carbon nanotubes) as thermally conductive interface materials. The invention also includes methods of cooling a semiconductor die in which coolant is forced through grooves in a backside of the die, and includes methods of making semiconductor packages.”
