Focused on Thermal Management, TIMs, Fans, Heat Sinks, CFD Software, LEDs/Lighting
November 13, 2013
Frankfurt, Germany
Presented by Mentor Graphics, this one-day seminar will cover a measurement system for the fast and very accurate thermal characterization of electronic components and systems (IC packages, MOSFETS, IGBTs, etc.). Attendees will experience hands-on practical exercises with the T3Ster Measurement System.
For more information, visit Mentor Graphics.
Electronics Cooling magazine has been providing a technical data column since 1997 with the intent of providing you, the readers, with pertinent material properties for use in thermal analyses. We have largely covered the most common materials and their associated thermal properties used in electronics packaging.
