Dow Corning has announced the release of two new thermally conductive adhesives, Dow Corning TC-2030 and Dow Corning TC-2035, for use with automotive electronics assemblies. The announcement was made today at Bondexpo in Stuttgart, Germany.
“It’s no understatement to say that the growth of automotive electronics is booming, resulting in unrelenting pressure on automotive electronics designers to push the functionality, reliability and overall performance of their products as hard and as far as they can,” Brice Le Gouic, global market manager for Transportation Electronics at Dow Corning, said. “With the launch of our innovative new Dow Corning TC-2030 and TC-2035 Thermally Conductive Adhesives, we offer the industry one of the most comprehensive thermal management portfolios for both standard electronics and next-generation, high-power electronic assemblies.”
Dow Corning TC-2030 Thermally Conductive Adhesive is the company’s most advanced thermal management solution for standard automotive electronics. Featuring a bond line thickness (BLT) of 130 microns (µm), the two-part heat-cured silicone technology reduces thermal resistivity with a high thermal conductivity of 2.7 W/mK. According to the company, TC-2030 is suitable for high-power underhood electronic applications, such as power steering, antilock breaking and electronic control modules.
Dow Corning TC-2035 Thermally Conductive Adhesive is ideal for use in next-generation automotive applications, including power electronics for electric and hybrid electric vehicles. Featuring 3.3 W/mK thermal conductivity and BLT as low as 50 µm, the two-part, heat-cured silicone bonds well to a variety of thermal substrate types, including direct bonding copper, high-density interconnect, low-temperature co-fired ceramic and printed circuit board. Dow Corning TC-2035 sustains reliable performance at temperatures reaching 200° C.
