U.S. Air Force officials have awarded multimillion dollar contracts to BAE Systems and Boeing Co. as part of DARPA’s Intrachip/Interchip Enhanced Cooling Applications (ICECool Applications) program.
The ICECool program seeks to develop advanced electronics cooling techniques for high-performance embedded computer (HPEC) and RF monolithic microwave integrated circuit (MMIC) power amplifiers by exploring the possibility of convective or evaporative microfluidic cooling installed directly into the electronic devices and packaging.
BAE Systems and Boeing Co. will join IBM Corp., who was awarded a contract last April for the ICECool Fundamentals program, as the latest two U.S. defense companies to take part in the initiative. The two companies will focus on enhancing the performance of RF power amplifiers and embedded computing by removing one kilowatt per square centimeter heat flux, as well as one kilowatt per cubic centimeter heat density, in high-performance embedded computing boards and RF MMICs, Military and Aerospace reported last week.
DARPA officials said they expect more contracts for the ICECool Applications program will be awarded in the near future.
