December 11-13, 2013
Singapore
EPTC 2013 will feature technical sessions, short courses/forums, an exhibition, social and networking activities. It aims to provide a good coverage of technological developments in all areas of electronic packaging from design to manufacturing and operation. It is a major forum for the exchange of knowledge and provides opportunities to network and meet leading experts in the field. Topics t be covered this year include TSV/wafer level and advanced packaging, interconnection technologies, materials and processes, modeling and simulation, thermal management and cooling technologies, testing and emerging technologies.
