Manufacturing company Henkel has released Loctite TAF, a new thermal absorbing film designed to address the heat management challenges associated with small but high-functioning handheld electronic devices.
“Managing the intense heat generated by today’s handheld products is one of the biggest challenges facing device designers today,” Jonathan Rowntree, vice president of global product management at Henkel, said. “While there are current solutions, they are limited in scope and can’t offer the [flexible] construction that will be required for next-generation device geometries.”
According to the company, the new patent-pending materials offer a unique approach to heat management through their ability to absorb, spread, insulate and dissipate thermal energy generated by integrated circuits, and are capable of lowering CPU and skin temperature of handhelds by more than 3°C.
Loctite TAF thermal absorbing films are available in customized, pre-cut sizes and thicknesses to accommodate specific application requirements. In addition, the film thickness and layer constructions can also be altered to create thinner or thicker solutions with multi-axis flexibility, enabling orientation over and/or under components.
