The U.S. Patent and Trademark Office has awarded patent No. 8,545,987, “Thermal Interface Material with Thin Transfer Film or Metallization” to Laird Technologies, Inc. of Earth City, Mo., USA.
According to background information provided by the inventors, the patent covers, “a thermal interface material assembly comprising: a thermal interface material having a first side and a second side, and which is conformable and comprises polymer; a metallization layer having a layer thickness of about 0.0005 inches or less, the metallization layer disposed along at least a portion of the first side of the thermal interface material; and a release liner having a release side with a release coating thereon; wherein the metallization layer comprises metal disposed over and directly on the release coating on the release side of the release liner such that the metallization layer is directly between the release coating and the first side of the thermal interface material, without any intervening layers; and wherein the release liner is configured to be removable from the thermal interface material assembly such that removal of the release liner exposes the metallization layer which remains disposed along the at least a portion of the first side of the thermal interface material for positioning against a mating component.”
