Fujipoly America Corporation has released its new Sarcon25GR-T2d thermal interface material, a soft, highly-conformable gap filler pad with a reinforced mesh center ideal for applications that require a thermal interface bridge across larger surface areas.
Once installed, the TIM delivers a thermal conductivity of 1.5 W/m°K per ASTM D2326 and a thermal resistance of 0.40 °Cin2/W at 43.5 psi. With its naturally tacky consistency, the material enables fast and easy assembly without any adhesive. 25GR-T2d is recommended for applications with operational temperatures between -40°C and +150°C and can be ordered in convenient 10 meter rolls or pre-cut sheets up to a maximum size of 200mm x 300mm.
