CoolClouds, Inc. has announced the availability of a new class of heat sinks for use in high performance computers or extreme environments starting mid-Q1 2014.
According to the company, SuprCool-PC is the first “in-chassis” heat sink to cool more than 300w in the latest Intel and AMD processors without hot spots at 65°C case temperature in 25°C ambient. Comparable in size to factory-installed heat sinks, it is reliable, quiet, easy to install and effective even in high-temperature environments.
“This is a significant advance,” CoolClouds CEO Ven Holalkere said. “Heat management, and hotspots in particular, are the greatest obstacle today to increased processor power. Air-cooled heat sinks are short on power; liquid-cooled heat sinks are short on convenience. We’ve developed a hybrid that seals liquid in a self-contained module that fits easily and quietly inside your computer chassis, and that uses a patent-pending micro-channeling technology to cool the liquid as it circulates. Performance this remarkable has never before been available in a package this convenient.”
