Dow Corning, a developer of silicon-based technology, has introduced new Dow Corning Dispensable Thermal Pads for use in LED, data server, telecommunications equipment and transportation thermal management applications.
“Compared to traditional fabricated thermal pads, new Dow Corning Dispensable Thermal Pads offer the potential for broader design latitudes, simplified manufacturing, and improved heat management – all promoting a lower total cost of ownership for finished electronics products,” Margaret Servinski, global manager for thermal management materials at Dow Corning said.
According to the company, use of the new dispensable thermal pads can reduce material costs by 30 to 60 percent by eliminating waste more common to conventional fabricated thermal pads. In addition, they also enhance thermal performance and accelerate manufacturing cycles. The new materials can be applied via standard screen or stencil print processes, or with standard dispensing equipment, and conform easily to complex and unevenly shaped substrates.
