Fujipoly has released SARCON SPG-50A, a form-in-place gap filler material with a thermal conductivity of 5.0 W/m°K.
Exhibiting ultra-low compression force, the new silicone-based compound is ideal for applications that have delicate components or low compression requirements. According to the company, the new thermal compound will not cause corrosion on metal surfaces and maintains all initial properties across a wide temperature range of -40°C to + 150°C. SPG-50A is available in either tubes or syringes.
