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Electronics Cooling

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Form-in-Place Thermal Compound for Delicate or Low Compression Requirements

Materials, Compounds, Adhesives, Substrates, New Products, TIMs

Fujipoly has released SARCON SPG-50A, a form-in-place gap filler material with a thermal conductivity of 5.0 W/m°K.

Exhibiting ultra-low compression force, the new silicone-based compound is ideal for applications that have delicate components or low compression requirements. According to the company, the new thermal compound will not cause corrosion on metal surfaces and maintains all initial properties across a wide temperature range of -40°C to + 150°C. SPG-50A is available in either tubes or syringes.

About the Author

Electronics Cooling

Electronics Cooling magazine has been providing a technical data column since 1997 with the intent of providing you, the readers, with pertinent material properties for use in thermal analyses. We have largely covered the most common materials and their associated thermal properties used in electronics packaging.

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