Universal Science, a provider of thermal management solutions, has introduced a reflowable, thermally conductive adhesive tape designed for application during PCB manufacturing.
Bondline 1000-Reflow can be laminated directly to PCBs prior to processing, enabling the PCBs to be finished/ supplied with a thermally conductive, mechanical fixing tape pre-applied and thus reducing additional production time and costs.. Formulated with acrylic adhesive and ceramic fillers, Bondline 1000-Reflow delivers a strong structural bond, making it ideal for mounting LED light engines to heat sinks. Bondline 1000-Reflow offers a thermal conductivity of 1.0 W/mK and has been tested to withstand up to 290°C.
