Fujipoly has released SARCON SPG-30A, a thermal interface material ideal for circuit boards with a large surface area, numerous components and delicate solder points.
Featuring high viscosity and ultra-low compression force, the form-in-place silicone compound completely fills all spaces, gaps and protrusions when compressed by a heat sink or spreader.
Once applied, SARCON SPG-30A delivers a thermal conductivity of 3.2 W/m°K with a thermal resistance of only .3°Cin2/W. The form stable thermal compound requires no heat curing, will not cause corrosion on metal surfaces and maintains all initial properties across a wide temperature range (-40C to + 150C).
