Semi-Therm, the world’s largest dedicated electronics thermal conference, will take place between March 15-19 at the Doubletree Hotel in San Jose, California. Now in its 31st year, this IEEE sponsored conference maintains its high standards in peer-reviewed papers covering a range of disciplines within the electronics cooling field.
As usual, the Mechanical Analysis Division of Mentor Graphics will be in attendance. Our division will be presenting 4 papers:
- “An Additive Design Heatsink Geometry Topology Identification and Optimization Algorithm” Robin Bornoff, John Parry. 3D printing is set to revolutionize rapid prototyping and manufacturing. Thermal design techniques will have to adapt to reflect the opportunities this presents. Myself and John have identified a novel approach to heatsink design, inspired by Bejan’s Constructal Law, that results in a heatsink topology being ‘grown’ based on a series of successive FloTHERM simulations. The details of ‘Dolly the Heatsink’ and how she was developed will be presented in Session 11 “Enhanced Heat Transfer” on Thursday, March 19.
- “Lifetime Estimation of Power Electronics Modules Considering the Target Application” Attila Szel, Zoltan Sarkany, Marton Bein, Robin Bornoff, Andras Vass-Varnai, Marta Rencz. Reliability prediction of power inverter modules involves a combination of both experimental methods to derive lifetime characteristics and simulation of the device under actual operating conditions. This flow will be presented in Session 12 “Quality and Reliability” on Thursday, March 19.
- “Application of the Transient Dual Interface Method in Test-Based Modeling of Heat-sinks Aimed at Socket-able LED Modules” András Poppe, Gusztáv Hantos (BUTE), János Hegedűs (BUTE). Another application of the method that underpins JESD15-14, to be presented in Session 9 “Measurements and Characterization II” again on Thursday, March 19.
- “Range and Probabilities of LED Junction Temperature Predictions based upon Forward Voltage Population Statistics” James Petroski. To be presented in Session 12 “Quality and Reliability” on Thursday, March 19.
So, Thursday, March 19th, a date for your diaries! I will also be presenting at one of the two vendor presentation sessions on the 17th or 18th (TBD) where I will show the forthcoming, major and exciting features of FloTHERM V11 with a focus on workflow automation.
I’ll do my best to leave the English weather where it belongs, in England, and see you in sunny CA soon!
