Focused on Thermal Management, TIMs, Fans, Heat Sinks, CFD Software, LEDs/Lighting
Don’t miss out on the September 2015 issue of Electronics Cooling, which includes feature articles on Heatsink Geometry Topology; On-site Cogeneration for Reducing Data Center Primary Energy Use; a Thermal Live Advance Program; and more.
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Read the September 2015 issue here
Electronics Cooling magazine has been providing a technical data column since 1997 with the intent of providing you, the readers, with pertinent material properties for use in thermal analyses. We have largely covered the most common materials and their associated thermal properties used in electronics packaging.
