Focused on Thermal Management, TIMs, Fans, Heat Sinks, CFD Software, LEDs/Lighting
March 24 – 26, 2016
Abu Dhabi – UAE
The main objective of this conference is to bring together researchers engaged in the application of experimental, analytical, or theoretical thermal and energy engineering. The suggested topics link between conventional and research areas in thermal energy.
More information here.
Electronics Cooling magazine has been providing a technical data column since 1997 with the intent of providing you, the readers, with pertinent material properties for use in thermal analyses. We have largely covered the most common materials and their associated thermal properties used in electronics packaging.
