According to Chinese site UDN, Samsung is looking for a heat-pipe supplier to dissipate heat from the Galaxy S7 smartphone’s processor.
“Tiny pipes inside the phone are filled with a liquid coolant, which circulates around the heat-producing components like the chipset and then away, taking excess heat with it,” Slash Gear reported.
Because space is limited in smartphones, Samsung is reportedly looking for a 0.6 mm thick solution or smaller.
“Chip heat has been a contentious topic in recent years, as smartphone manufacturers chase greater performance and users become more demanding of their devices,” Slash Gear added.
