2016 Electronics Packaging Symposium
Oct. 5 – 8, 2016
Binghamton, NY, USA
TECHNOLOGY ADVANCES IN SMALL SCALE SYSTEMS & MICROELECTRONICS PACKAGING
The 2 day program will include Keynote Lectures, Technical Presentations, a Half-day 2.5/3D Workshop, and a Student Poster Session on topics including:
-3D Packaging
-Thermal Challenges
-Flexible and Additive Electronics
-MEMS, Sensors, and Microfluidics
-Material Challenges
-Harsh Environments
-Energy Conversion and Storage
-Embedded Electronics
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