Fujipoly recently introduced its new thin film, thermal interface product, Sarcon® YR‐c.
The Sarcon® YR‐c effectively eliminates near‐microscopic air gaps that exist between components when placed between a heat source such as a high‐performance semiconductor and a nearby heatsink, said Fujipoly.
The Sarcon® YR‐c delivers a thermal conductivity of 4.0 W/m°K with a thermal resistance of only .08°Cin2/W, is available in thicknesses of 0.2, 0.3, and 0.45mm, can be ordered in roll form up to 150mm wide or can be die‐cut to your exact specification requirements, and is recommended for applications with operational temperatures that range from ‐40°C to +150°C, according to Fujipoly.
