Chomerics Europe, a division of Parker Hannifin, has recently revealed a new thermal interface material with high thermal conductivity and very low deflection force designed for effective heat dissipation in telecommunication, IT, and automotive applications, THERM-A-GAPTPS60.
“THERM-A-GAP TPS60 comprises a soft (Shore 00-35) silicone matrix filled with thermally conductive particles” said RadioElectronics.com, “[This] gap filler enables low thermal contact resistance under low applied pressure, and is targeted at the filling of air voids between PC boards or high temperature components, as well as heatsinks, metal enclosures and chassis.”
“The product’s conformability in combination with its high thermal conductivity reduces the risk of damaging fragile components and ensures fast heat transfer away from electronic components,” according to RadioElectronics, who also said it’s “ideal for critical heat dissipation task applications such as thermally-enhanced ball grid arrays, memory packages and modules, [and] GPU/CPUs.”
This RoHS-compliant product offers a standard thickness of 1.0 to 5.0mm, as well as a thermal conductivity of 7.5W/m-K@20psi, electrical isolation, and a specific gravity of 3.26.
