(April 19th, 2016) Henkel’s Adhesive Technologies recently won two NPI Awards presented at last month’s APEX event in Las Vegas, as reported by EMCNow.com.
According to EMCNow.com, Henkel had its third consecutive win in the Solder Materials category for its Loctite® GC 3W material, and won the Underfill/Thermal Interface Materials category for its Gap Pad® EMI 1.0 material.
“Henkel’s water soluble solder paste, Loctite GC 3W, […] a lead-free, halogen-free, halide-free material, […] combines high-activity flux performance and temperature stability,” reported EMCNow.com.
“Recognizing the challenges that miniaturization, higher functionality and greater component density have placed on assembly specialists, Henkel developed the dual-function Gap Pad EMI 1.0 thermal interface material to address the requirements of both heat dissipation and electromagnetic interference (EMI) control in a single material solution,” EMCNow.com reported.
To read more about the winning products, click here.
