(June 13, 2016) Device manufacturers are making more accurate, compact medical equipment with electronics technology.
MedicalPlasticsNews.com reported that they are using “pressure-sensitive adhesives (PSAs)” which were “developed as a heat sink attachment method to eliminate the need for clamping” for “interconnects, grounding and shielding applications in medical equipment”.
“They feature an adhesive coated on to a continuous web of a substrate material such as polyimide film, fiberglass mat, or aluminium foil in either single-faced, double-faced, or transfer adhesive constructions and wound into large rolls that are then converted to the exact specifications required for the end application,” according to MedicalPlasticsNews, and, “They have the capability to be precisely die cut into custom shapes and narrow widths for improving manufacturing efficiency with mess-free processing.”
MedicalPlasticsNews observed, “As device manufacturers face the pressures of faster prototyping, quick changeovers and the increased use of automation, the advantages of PSAs over labor-intensive soldering operations are becoming more evident.”
Electrically conductive or thermally conductive adhesives are additionally desirable capabilities that are being looked in to.
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