(July 13, 2016) Recently, associate professor Baratunde Cola of the Woodruff School of Mechanical Engineering at the Georgia Institute of Technology uncovered the “potential of silicon dioxide nanoparticles coated with a high dielectric constant polymer for cooling power-hungry electronic devices,” reported Hexus.net.
According to Hexus, “the cooling occurs as the result of a nanoscale electromagnetic effect created on the surface of these [silicon dioxide] ‘sand’ particles.” According to Professor Cola, “The nanoparticle effect increases the thermal conductivity of the particles 20-fold,” which is “enough of a boost to make this material to the ranks of “expensive polymer composites used for heat dissipation”.”
This material is “said to have the potential to outperform conventional heatsink materials,” reported Hexus.
To read more, click here.
