by MP Divakar, PhD, Stack Design Automation (www.stack-da.com)
Technical Editor, Electronics Cooling Online
It gives me great pleasure to join the electronics thermal management community as the Technical Editor for the online edition of Electronics Cooling Magazine. Electronics-Cooling.com remains the preeminent online resource for all things related to the cooling of electronic components and systems.
With nearly two decades of experience in designing and successfully launching many new electronics products at components-, modules-, systems-, enclosures- and rack-level, I still find the ecosystem of electronics cooling as challenging to navigate as it was in the early days of my career. The reasons are manifold. As consumer electronics products pervade in all walks of our lives, the burden hence the opportunity falls on the electronics hardware engineers to design and make things exceedingly better performing and at lesser price tags. In that hardware ecosystem, thermal management has become the most important topic to address at the outset.
It is not an exaggeration to say that electronics thermal management has never been more challenging today than ever before. Our ecosystem has expanded. It has never been more multidisciplinary. Electronics cooling engineers have to be fully aware of and design for the thermal, thermo-mechanical, and biological effects of heat on objects, humans, components, and systems. Today’s thermal engineers not only deal with ever the increasing challenges of conventional hardware such as network appliances, servers, etc., but they also must contend with IoT devices, smart phones, wearables, body-embedded electronics, automotive applications, etc. Your “Father’s Oldsmobile” had a radiator, but many of today’s electric vehicles have more intricate closed loop cooling systems to manage batteries and powertrains!
At Electronics Cooling, we will make every effort to keep you informed about the latest developments in our expanding ecosystem. To that end, we have identified the following topical categories:
- Thermal Management of Consumer Electronic Devices
- Wearables & Bio-Thermal Management
- Connected / Smart Home Components & Systems
- Automotive & Power Electronics Thermal Management
- Battery Thermal Management (non-automotive)
- Thermal Management Challenges in Enterprise & Data Center Networks
- Thermal Management of Printed & Flexible Electronics Products
- Stacked 3DIC / 2.5D / MEMS / SoC and Modules
- Military and Aerospace
- Design & Simulation Tools
- Thermal Characterization & Testing
- R&D and Advanced Topics
In the coming weeks, more details on the above categories of thermal management will be featured in blog posts like this one. But we would love to hear from you in the interim – if you have any suggestions or recommendations for topics to cover, we would be very interested in receiving your feedback! Please feel free to email me at mp@electronics-cooling.com.
Lastly, I would be remiss in my duties if I didn’t mention Thermal Live 2016, our premier online event. This year we are pulling out all the stops to cover as many categories cited above as possible! More information and registration links can be found now at Thermal.Live!
