This article is a summary of a webinar presented by ACT at Thermal Live Fall Summit in 2023.
Introduction to Active Thermal Management Systems
In the realm of high power density systems, effective heat management is not just a necessity; it’s a critical component of functionality and longevity. These systems, found in everything from advanced computing to industrial machinery, generate significant amounts of heat. Traditional cooling methods often fall short in addressing the unique challenges posed by such high-density power outputs. This is where active thermal management systems come into play, offering sophisticated solutions to tackle heat effectively.
Challenges in High Power Density Systems
The primary challenge in managing heat in high power density systems is the sheer intensity and concentration of heat produced. Such systems often have limited space, demanding compact yet efficient cooling solutions. Traditional methods, such as passive cooling, can’t keep up with the heat flux generated by these advanced systems, necessitating a move towards more dynamic solutions.
Technologies in Active Thermal Management
Active thermal management technologies offer a diverse range of solutions. Enclosure coolers, like ACT’s HPC and HSC units, use advanced heat exchangers and heat pipes to facilitate above-ambient cooling. These units are adept at handling intense heat loads while maintaining a compact footprint.
Vapor compression-based products represent another frontier in active cooling. These systems utilize the vapor compression cycle, a process involving compression, condensation, expansion, and evaporation of a refrigerant to absorb and dissipate heat. This method is particularly effective for sub-ambient cooling applications.
Applications and Scenarios
Active thermal management systems find their applications in a wide array of scenarios. From cooling small electronic enclosures to managing the thermal environment of larger systems housing sensitive electronics and personnel, these systems provide efficient and reliable solutions. In the realm of discrete device-level cooling, single-phase and pump two-phase systems are noteworthy. These systems offer targeted cooling for electronic components, crucial for maintaining operational integrity and preventing overheating.
Energy-Efficient Solutions in Sub-Ambient Cooling
Energy efficiency is a key consideration in modern cooling solutions, especially in sub-ambient applications. The integration of vapor compression with pump two-phase technology marks a significant advancement in this field. This synergy not only provides effective cooling across various ambient conditions but also optimizes energy usage, a critical factor in sustainable and cost-effective operations.
Conclusion
The importance of active thermal management in high power density systems cannot be overstated. As technology advances, the demand for effective, efficient, and compact cooling solutions will only grow. The continual evolution and innovation in this field are essential to meet the thermal management challenges of today and tomorrow.
