Laird Technologies, Inc., a designer of customized performance-critical components and systems for advanced electronics and wireless products, has announced the release of Tflex SF800 and Tflex SF200, two new Tflex series thermal gap fillers.
According to the company, “Tflex SF800 is a high performance gap pad with exceptional wetting characteristic, while Tflex SF200 features extremely low contact resistance for effective heat transfer.” Both products are available in a variety of thicknesses, and both products are equipped with a natural tackiness on both sides for application.
The SF800 offers a thermal conductivity of 7.9 W/mK, while the SF200 offers thermal conductivity of 1.8 W/mK or 2.0 /mK, depending on the thickness.
