Dow Corning, a developer of silicone-based technology, has announced new dispensable thermal pads developed for more cost-effective thermal management in LED lighting applications.
Dow Corning’s new product line of dispensable thermal pads features four grades “distinguished by varying levels of thermal conductivity with or without controlled bond line thicknesses.” Dow Corning TC-4015 and TC-4016 dispensable thermal pads offer thermal conductivity of 1.5 W/mK, while Dow Corning TC-4025 and TC-4026 dispensable thermal pads offer 2.5 W/mK thermal conductivity. In addition, Dow Corning TC-4016 and TC-4026 dispensable thermal pads incorporate glass beads for improved control over bond line thickness.
The new materials bond well with common lighting substrates and can be applied using standard screen print or stencil print processes, or standard dispensing equipment.
