DuPont Circuit & Packaging Materials, part of DuPont Electronics & Communications, announced earlier this week that it has increased production at its Hsinchu, Taiwan facility by more than seven times the previous amount to better accommodate demand for its CooLam thermal substrate products.
DuPont CooLam thermal substrates are designed to help dissipate heat in LED lighting applications, thereby increasing lifespan, reliability and light quality in LED bulbs. Made with a proprietary polymide dielectric designed to be thermally conductive and featuring low thermal impedance and a maximum operating temperature of 180°C, the CooLam thermal substrates dissipate heat more rapidly and reliably than conventional filled epoxy-based boards, the company said.
“Demand for LED lighting is expected to surge while the price of LED bulbs continues to fall, as evidenced by the high-quality, energy-efficient $10 USD LED bulbs that are now available from home improvement stores,” Michael Green, global business development manager of DuPont Circuit & Packaging Materials, said. “We expect to see even more LED lighting products made with DuPont CooLam thermal substrates as the market continues to grow, and are extremely pleased to increase our ability to supply more of this innovative material to enable our customers to produce LED lighting with longer life, greater reliability, affordability and better light quality.”
