Electronic components manufacturer ASSMANN WSW has released a new series of stamped CPU heat sinks for cooling pin grid arrays, ball grid arrays or other high power components. The series is available from distributor Rutronik.
According to the company, the new CPU heat sinks offers an improve air convection of up to five percent because of non-simultaneous heating from one cooling fin to the other, which results in a better heat exchange between the various “hot and cold” air layers. Manufactured from AL5052 aluminum alloy, the new CPU heat sinks can be mounted via push pins or solder pins. Single- or double-sided thermal adhesive tape is included, and custom notches in the heat sink can be attained through modifications of the tool.
