Carbodeon, a supplier of superhard materials such as nano-diamonds and graphitic carbon nitride, has released a new thermally-conductive nanodiamond filler it claims increases the conductivity of thermally-conductive polymers by 25 percent.
According to the company, the increase in thermal conductivity is achieved without affecting the electrical insulation or other mechanical properties of the material, making it an ideal choice for a wide range of electronics and LED applications. The formulation of the new material is based on PA66 with 45 percent by weight boron nitride thermal filler; however, the boron nitride filler was replaced with a new mixed filler comprised of 44.9 percent by weight boron nitride and 0.1 percent by weight uDiamond NanoDiamond material.
“The performance improvements achieved by this filler are derived from the extremely high thermal conductivity of diamond, at around 2000 W/mK,” Vesa Myllymäki, chief technology officer at Carbodeon, said. “The key development made by Carbodeon is to tune the surface chemistry of the diamond particles and mixing process to develop a nano-composite in which the diamond is very well interfaced to the polymer molecules.”
