Laird Technologies has announced a new series of miniature thermoelectric modules for applications where temperature stabilization of sensitive optical components in photonics, telecom, medical and consumer markets is critical. Built using Laird Tlam thermally conductive circuit boards instead of traditional ceramic-based circuit boards, the new TIam OptoTEC series improves the heat pumping capabilities of the device while providing excellent heat spreading, more reliability and lower cost in high volume compared to traditional heat removal systems.
The TIam OptoTEC circuit boards are constructed with a thin layer of thermally conductive dielectric material sandwiched between a top layer of standard copper foil and a thick metal backing plate for structural strength and improved heat spreading.
The Tlam OptoTEC series includes seven new modules that can create a temperature differential (ΔT) of up to 67°C and pump from 1.5 to 9.0 watts of heat at an ambient temperature of 25°C. At 85°C, the series can create a ΔT of 77°C and pump 1.6 to 9.9 watts of heat. The modules have passed Telcordia GR-468-CORE Issue 2 reliability qualification testing and are customizable to accommodate alternate sizes, heat pumping capacities, unique circuit patterns and pre-tinning requirements.
“Laird is the only company in the world that makes both TEMs and thermally conductive circuit boards,” Andrew Dereka, product manager at Laird Technologies, said. “We are uniquely positioned to offer innovations based on this combination of thermal management technologies to our customers.”
