Ohmite Manufacturing, a provider of thermal solutions and resistors, has released its new B60/C60 heat sink system ideal for use with high power density and small size (3U or 4U) electronic packaging with forced convection.
The new B60/C60 heat sink system provides designers with a variety of cooling options for up to six TO-246 or TO-264 devices, such as TO-247 and TO-264 power resistors. The B60 version also offers sufficient mounting surface for a variety of larger components, such as the Ohmite WFH90 series, 850 series or TGH series SOT-227 packages.
Equipped with Ohmite’s patents camming clips, which enable designers to secure TO devices in place without the need for holes or screws, the new 75-mm long heat sinks can be used individually or in pairs with the ability to accommodate a standard 60mm x 60mm fan for active cooling.
