Focused on Thermal Management, TIMs, Fans, Heat Sinks, CFD Software, LEDs/Lighting
May 27 – 30, 2014
Lake Buena Vista (Orlando), FL, USA
The IEEE Electronics Components Technology conference (ECTC) is the premier electronics packaging conference. This year it features 5 invited sessions and 41 technical sessions (including 8 3D/TSV technology sessions), 18 professional development courses and over 90 vendors.
For more information, visit the ECTC website here.
Electronics Cooling magazine has been providing a technical data column since 1997 with the intent of providing you, the readers, with pertinent material properties for use in thermal analyses. We have largely covered the most common materials and their associated thermal properties used in electronics packaging.
