3M’s Electronics Markets Materials Division (EMMD) has released 3M 8904, a thermally conductive adhesive tape for thermal management and part bonding in electronic devices, as well as general heat dissipation.
Containing thermally conductive particles as well as flame resistant fillers, 3M 8904 offers twice the thermal conductivity at half the material cost. The new adhesive is available in thicknesses of 0.20mm, 0.25mm, and 0.50mm for excellent wet-out or conformability to many different substrates.
3M 8904 offers good thermal conductivity of >1.5W/m-K, excellent dielectric performance, low thermal impedance, good adhesion performance and vibration damping. Ideal applications include heat sink bonding, IC chip packaging heat conduction, LED module/board bonding, COF cheap heat conduction and mechanical fastening.
