DELO, a manufacturer of industrial adhesives for automotive, consumer and industrial electronics applications, has released a new heat-curing adhesive that cures to full strength in temperatures as low at 60°C. The new DELOMONOPOX LT204 epoxy resin minimizes thermal stress and warping of components being bonded, making it ideal for optical packaging and other applications where multiple temperature-sensitive materials are bound together.
Designed for bonding and casting of compact camera modules, electronic assemblies, mobile assemblies, infrared LEDs and image sensors that feature micro-optics, DELOMONOPOX LT204 offers low thermal stress and moderate shrinkage during curing. The multi-purpose, one component adhesive can be processed within 48 hours at room temperature and offers excellent adhesion to many plastics, including LCP, PA and PPS, as well as to metals and FR4 composites.
DELOMONOPOX LT204 can be dispensed through needles with a diameter as small as 200 µm, which are common in consumer electronics, and offers a storage life of four months at -18°C.
