IEEE Electronic Components and Technology Conference – ECTC 2016
Las Vegas, NV, USA
May 31 – June 3, 2016
For more information, click here.
IEEE Electronic Components and Technology Conference – ECTC 2016
About the Author
Electronics Cooling
Electronics Cooling magazine has been providing a technical data column since 1997 with the intent of providing you, the readers, with pertinent material properties for use in thermal analyses. We have largely covered the most common materials and their associated thermal properties used in electronics packaging.
