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Electronics Cooling

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Guarantee Reliability with Thermal Cycling Webinar

Industry Updates

Guarantee Reliability with Thermal Cycling Webinar
Online (Webinar series)
January 28, 2016 – 11am and 2pm

This webinar provides an overview of thermal cycling induced failures in printed circuit board assemblies. The two main failure modes that are explored are solder joint and plated through hole fatigue. A close examination of the effect of board properties will also be provided. We will discuss the usage of analytical and semi-analytical prediction methodologies.

For more information and to register, click here.

About the Author

Electronics Cooling

Electronics Cooling magazine has been providing a technical data column since 1997 with the intent of providing you, the readers, with pertinent material properties for use in thermal analyses. We have largely covered the most common materials and their associated thermal properties used in electronics packaging.

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