Cradle has recently released PICLS V2, which is now simply PICLS (whereas V1 is now called PICLS Lite).
PICLS has external file interfaces for IDF 3.0, Gerber wiring data, and drill data import. In addition, parts/components created for a model can be saved in the Library for future shared use. PICLS can also model plate fin and heat dissipation plate heat sinks. In PICLS Lite, PCB models must be built manually using basic modeling features.
PICLS is available as a floating license and can also be evaluated using a trial license. PICLS Lite is available license-free by submitting an application form, then downloading PICLS Lite from the Cradle download page and installing the software on a local computer.
Cradle’s PICLS (PCB Instant Thermal Simulation) is an easy to use, real-time, PCB thermal analysis tool used by electrical designers to rearrange components on a PCB, or change the board design, and instantly see thermal transfer effects and changes to temperature distributions. Results can be output as a report or seamlessly imported into Cradle scSTREAM or HeatDesigner for system level analysis.
