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Due to the demand of liquid cooling connections in high performance computing, many engineers are now looking to find the right components that facilitate optimal cooling. The foundation begins with the combination of the right termination and connection. Read our case study on how to ensure you’re getting the right termination for a leak-free HPC application.
Electronics Cooling magazine has been providing a technical data column since 1997 with the intent of providing you, the readers, with pertinent material properties for use in thermal analyses. We have largely covered the most common materials and their associated thermal properties used in electronics packaging.
