Purdue University researchers, led by Suresh V. Garimella, have developed a new design employing carbon Nanotubes and small copper spheres that wicks water passively towards hot electronics that could meet the challenges brought on by increasing frequency speeds in chips.
The researchers came up with a design that uses water as the coolant liquid and transfers the water to an ultrathin thermal ground plane. The design naturally pushes the water through obviating the need for a pump and through the use of microfluidic design is able to boil the water fully, which allows the wicking away of more heat.
